Description

The V•I Chip Bus Converter Module (BCM) is a Sine Amplitude Converter that offers superior performance, the highest efficiency, and highest power density in the smallest package available. BCMs provide an isolated intermediate bus voltage to power non-isolated PoL (Point-of-Load) converters or serve as an isolated voltage source for ATE, server, telecom, and industrial control applications.

  • Fast response time
  • Low noise
  • Saves board area, materials and total system cost
  • Through-hole option available, except in half-chip package

Full-chip and half-chip BCMs are compatible with standard pick-and-place and surface-mount assembly processes.

Full-Chip BCM:
  • Input Voltage: 48 V (38 – 55 V)
  • Output Voltage: 2.4 – 55.0 V
  • Output Power: 210 – 300 W
  • Output Current: 6 – 70 A
  • Efficiency: Up to 96%
Half-Chip BCM:
  • Input Voltage: 48 V (38 – 55 V)
  • Output Voltage: 12 V
  • Output Power: 120 W
  • Output Current: 11.3 A
  • Efficiency: Up to 96%
High Voltage BCM:
  • Input Voltages:
    270 V (240 – 330 V)
    352 V (330 – 365 V)
    384 V (360 – 400 V)
  • Output Voltage: 10 – 13 V, 42 – 50 V
  • Output Power: 300 – 325 W
  • Output Current: 7.0 – 28.0 A
  • Efficiency: Up to 96%
Dimensions per module:
  • Full-Chip: 1.28″ x 0.87″ x 0.265″
    (32.5 x 22.0 x 6.73 mm)
  • Half-Chip: 0.87″ x 0.65″ x 0.265″
    (22.0 x 16.5 x 6.73 mm)

  • High power density
  • Small footprint
  • Low weight
  • High frequency ZVS / ZCS Sine Amplitude Converter (SAC™)
  • Isolated output
  • Bulk capacitance elimination

Data Sheet Matrix

VI Chip Family Overview

Output Voltage (V) Input Voltage (V)
48 (38 – 55) 352 (330 – 365) 380 (260 – 410) 384 (260 – 410) 384 (360 – 400) 400 (260 – 410)
3 BCM48Bx030x210A00 — — — — —
4 BCM48Bx040x200B00 — — — — —
6 BCM48Bx060x240A00 — — — — —
8 BCM48Bx080x240A00 — — — — —
9.6 BCM48Bx096x240A00 — — — — —
11 — BCM352x110T300B00 — — — —
12 BCM48BH120x120B00 BCM48Bx120x300A00 — — BCM384P120T1K5AC0 BCM384P120T800AC0 BCM384P120T1K5AC1 BCM384P120x800AC1 BCM384x120x300A00 —
12.5 — BCM325x125T300A00 — — — —
16 BCM48Bx160x240A00 — — — — —
24 BCM48Bx240x300A00 — — — — —
32 BCM48Bx320x300A00 — — — — —
44 — B352x440T330A00 — — — —
47.5 — — BCM380x475x1K2A30 BCM380x475x1K2A31 BCM380P475T800A30 BCM380P475x800A31 — — —
48 BCM48Bx480x300A00 — — — BCM384x480T325A00 —
50 — — — — — BCM400x500x1K8A30 BCM400x500x1K8A31

Full-Chip BCM
Half-Chip BCM
Full-Chip HV BCM
6123, 2361 High Voltage

All V•I Chips are RoHS Compatible
Description Lead Type Product Outline Drawing 3-D Model Drawing
Full-Chip BCM with J-Lead mounting J-Lead PDF | DXF IGS | STP
Full-Chip BCM with through-hole mounting Through-Hole PDF | DXF IGS | STP
Half-Chip BCM with J-Lead mounting J-Lead PDF | DXF IGS | STP
6123 through-hole mounting Through-Hole PDF | DXF IGS | STP

An easy way to get up and running with the BCMTM Bus Converter The BCM Evaluation Board has been designed to facilitate the verification of the V•I Chips superior performance in the areas of power density, efficiency (over a wide load range), fast response and quiet, low-noise operation. An evaluation board is also available for the half-chip BCM.

BCMTM Bus Converter Customer Evaluation Board
Full Chip
P/N Input
Voltage (V)		 Output
Voltage (V)		 Output
Power (W)		 User Guide
BCD48BF030T210A00 48 3.0 210 PDF
BCD48BF060T240A00 48 6.0 240 PDF
BCD48BF080T240A00 48 8.0 240 PDF
BCD48BF096T240A00 48 9.6 240 PDF
BCD48BF120T300A00 48 12.0 300 PDF
BCD48BF160T240A00 48 16.0 240 PDF
BCD48BF240T300A00 48 24.0 300 PDF
BCD48BF320T300A00 48 32.0 300 PDF
BCD48BF480T300A00 48 48.0 300 PDF
HV Full Chip
P/N Input
Voltage (V)		 Output
Voltage (V)		 Output
Power (W)		 User Guide
BCD352F125T300A00 352 12.5 300 PDF
BCD352F440T330A00 352 44.0 325 PDF
BCD380P475T1K2A30 380 47.5 1.200 PDF
BCD380P475T1K2A31 380 47.5 1.200 –
BCD380P475T800A30 380 47.5 800 PDF
BCD380P475T800A31 380 47.5 800 –
BCD384P120T1K5AC0 384 12.0 1.500 –
BCD384P120T800AC0 384 12.0 800 –
BCD384P120T1K5AC1 384 12.0 1.500 –
BCD384P120T800AC1 384 12.0 800 –
BCD384F480T325A00 384 48.0 325 PDF
BCD400P500T1K8A30 400 50.0 1.750 PDF
BCD400P500T1K8A31 400 50.0 1.750 –

  • QPI-9-CB1 Carrier Board – Compatible with 24 V Input V•I Chip “-CB” Boards, up to 6 Amps
  • QPI-11-CB1 Carrier Board – Compatible with 24 V Input V•I Chip Module “-CB” Boards, up to 7 Amps
  • QPI-12-CB1 Carrier Board – Compatible with 48 V input V•I Chip Module “-CB” Boards, up to 7 Amps

For Full Chip All Heat Sinks are RoHS Compatible
Description Fin
Height		 P/N Product Assembly Drawing Product Outline Drawing 3-D Model Drawing
Transverse Fins 11 mm 34072 * PDF PDF |DXF IGS | SAT | STP
Transverse Fins 6.3 mm 34073 * PDF PDF |DXF IGS | SAT | STP
Longitudinal Fins 11 mm 34074 * PDF PDF |DXF IGS | SAT | STP
Longitudinal Fins 6.3 mm 34075 * PDF PDF |DXF IGS | SAT | STP
* Push pins not included
Top-side Heat Sinks for VI Chip (6123) Modules All Heat Sinks are RoHS Compatible
Description Fin
Height		 P/N Product Assembly Drawing Product Outline Drawing 3-D Model Drawing
Longitudinal Fins 11 mm 40145 * PDF PDF |- – | – | –
Longitudinal Fins 11 mm 40485 * PDF PDF |- – | – | –
Dual-sided Heat Sinks for VI Chip (6123) Modules All Heat Sinks are RoHS Compatible
Description Fin
Height		 P/N Product Assembly Drawing Product Outline Drawing 3-D Model Drawing
Longitudinal Fins 11 mm 40520 * PDF PDF |- – | – | –
* Push pins not included

Push Pins For V•I Chip (6123) Modules (100 pieces per package) – Top-sided Heat Sink application
All Heat Sinks are RoHS Compatible
Pin Size P/N Drawing
0.051″ – 0.069″ PCB 32434 PDF
0.070″ – 0.104″ PCB 32435 PDF
0.105″ – 0.132″ PCB 32436 PDF
0.133″ – 0.156″ PCB 32437 PDF
Push Pins For V•I Chip (6123) Modules (100 pieces per package) – Dual-sided Heat Sink application
All Heat Sinks are RoHS Compatible
Pin Size P/N Drawing
0.045″ – 0.073″ PCB 32436 PDF
0.074″ – 0.096″ PCB 32437 PDF